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News

2024/10/11

News Release

Ohio State University Selects Taiyo Nippon Sanso MOCVD and HVPE Platforms for Research and Development of Advanced Nitride and Oxide Materials and Devices
2024/09/30

News Release

TNSC Innovation Center Hibikino Opened at Kitakyushu Science and Research Park
—Encourage Collaborative Development of Semiconductor-Related Equipment by Industry, Academia, and Government—
2024/09/25

Notice

Publication of “Integrated Report 2024” by NIPPON SANSO HOLDINGS
2024/09/11

News Release

Achieving Both High-Speed and Defect-Less Metal Printing!
TNSC Develops Additive Manufacturing Technology Using TIG Welding and the Dedicated “3DPro^® RotoTIG” Torch
2024/07/26

News Release

Contributing to the Reduction of CO₂ Emissions Equivalent to More Than 100,000 Tons per Year!
Tsukuba Diecasting Receives IMA Environmental Award by Using MG Shield Fireproof Cover Gas
2024/07/12

News Release

【Nippon Sanso Holdings】 Participated in OIST Coral Project by Okinawa Institute of Science and Technology Graduate University as Special Partner
2024/07/08

News Release

Krypton and Xenon Gas Manufacturing Equipment Completed at the Fukuyama Plant of JFE Sanso Center Corporation
2024/07/08

News Release

Notice Regarding Completion of Large Air Separation Unit at the Fukuyama Plant of JFE Sanso Center Corporation
2024/06/20

News Release

Lit Thinking Selects Taiyo Nippon Sanso MOCVD Platform to Enable New UVLED Technologies and Commercial Products
2024/06/10

News Release

Carbon-Free Abatement system for the Semiconductor Industry
Started Sales of Blisters Burner H₂, a Hydrogen Combustion-Type Exhaust Gas Abatement System

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